Foundries build bridges to design

摘要

FOUNDRIES are building stronger links to design and IP suppliers as they try to overcome the problems of designing for the latest generation of chipmaking processes. A week after Taiwanese foundry TSMC released a set of data formats intended to speed up the job of communicating complex chip-design rules to fabless customers, Synopsys joined ARM and the Common Platform group of foundries led by IBM in detailing a development environment for producing mobile-device chips on their upcoming 32nm and 28nm processes.