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As User Demand Diversifies, Solder Makers Ride on New Trends

机译:随着用户需求的多样化,焊料制造商顺应了新趋势

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摘要

To meet the varying demands of users, solder manufacturers continue to bring out new products in the market. Recently, manufacturers have yielded to the latest trends, such as solder pastes that are halogen-free, low silver content, as well as low melting point solders and solder balls.The solder industry has also continued introducing products that meet new environmental regulations. These regulations include compliance to lead-free and halogen-free solders, compliance to standards such as of Restrictions on the Use of Hazardous Substances (RoHS) Directives of Europe and China, and the Registration, Evaluation, Authorization, and Restriction of Chemical substances (REACH) of Europe. At the same time, the demand has also increased for low silver content solders and low melting point solders aimed at cost reductions, as well as those for solder bumps formed through electroplating of solder for flip-chip connection in semiconductor packages. These new regulations have brought the solder industry to rapid changes, prompting manufacturers to propose new trends that suit the needs of users.
机译:为了满足用户的不同需求,焊料制造商不断在市场上推出新产品。最近,制造商已经屈服于最新趋势,例如无卤素、低银含量的焊膏,以及低熔点焊料和焊球。焊料行业也不断推出符合新环境法规的产品。这些法规包括符合无铅和无卤焊料,符合欧洲和中国有害物质使用限制 (RoHS) 指令以及欧洲化学物质注册、评估、授权和限制 (REACH) 等标准。同时,以降低成本为目的的低银含量焊料和低熔点焊料,以及半导体封装中倒装芯片连接用焊料电镀形成的焊料凸点的需求也在增加。这些新法规使焊料行业发生了快速变化,促使制造商提出适合用户需求的新趋势。

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