DEVELOPMENT OF AN ELECTRONIC PACKAGING TECHNIQUE USING CONDUCTIVE ADHESIVES FOR NOVEL HUMAN-MACHINE INTERFACES

摘要

Super-flexible wires, electrodes and interconnections were developed using conductive adhesives containing Ag particles dispersed in a silicone-based binder. After curing under suitable conditions, electrical conduction in the adhesives was detectable until the elongation reached 100-180% (test speed: 8.33 μm s~(-1)). The electrical conductivity of the conductive adhesives was improved successfully when Ag nanoparticles were mixed into the adhesive paste with non-reactive diluents. The electronic packaging technique using the silicone-based conductive adhesives was applied to the fabrication of prototype sensor sheets for artificial skin applications in robots and related equipment. In order to fabricate the sensor sheet (artificial skin), the piezoelectric polymer films composed of poly(vinylidene fluoride) (PVDF) were assembled on a silicone substrate, followed by the silicone rubber coating. A piezoelectric response from the PVDF films embedded into the silicone rubber was detected successfully when we touched the sheet. Super-flexible wires and interconnections are expected to be a key technology for realizing novel human-machine interfaces installed in robots and related equipment.