Measurement of biaxial stress using an electrodeposited copper foil with a microcircular hole (4th report, method using the probability process of the occurrence of slip line)

摘要

The dependence of slip line occurrence at the periphery of microcircular holes formed by photoetching in an electrodeposited copper foil upon the number of cycles and cyclic stress magnitude for plane bending and cyclic torsion is examined. Theresults show that the principal stresses in the element under biaxial stress, which are undetectable by the conventional copper electroplating method, can be evaluated using the equation based on the probability process of slip line occurrence, whichtakes into account both cyclic stress magnitude and the number of cycles.