In the double disk grinding machine for silicon wafers developed by SHI, both the high positioning accuracy at the tip of the tool and the high positioning stiffness are realized through the newly developed positioning mechanism composed of the double-V type sliding guide-way and the force operation type hydraulic water actuator. It is generally known that on the positioning system involving the friction, the positioning accuracy deteriorates due to the unstable phenomenon such as the stick-slip caused by the nonlinear friction characteristics. So we have decided to better the understanding of the positioning characteristics and optimize the mechanisms and control method by applying the developed positioning simulator based on the precision frictional characteristic formula. The paper gives the detailed description of the newly developed simulator as well as the reproduced simulation results that describe well the non-linear positioning behavior due to the friction and show good agreement with experimental results.
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