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FUTURE: CRUNCH TACTICS

机译:未来:紧缩战术

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摘要

The semiconductor industry presents unusual challenges to supply-chain management, which make it harder to predict when shortages will hit. The core problem is time. It takes months for an individual chip to make it from a wafer being sliced from a silicon ingot to being packed into a tube or mounted on a reel ready to be shipped to an assembly plant. The customers' orders will be shifting at a different rate, creating spikes and slumps in demand to which chipmakers cannot easily react. In the wake of the dot-com slump some suppliers diverted unfinished wafers to nitrogen storage at a point in manufacture where the chips onboard would not degrade before being returned to the fab to be finished. They have even fewer options when faced with a peak in demand: whatever is ordered cannot turn up in less than three months even with dedicated production.
机译:半导体行业给供应链管理带来了不同寻常的挑战,这使得预测短缺何时到来变得更加困难。核心问题是时间。单个芯片从硅锭上切下晶圆到包装到装入管中或安装在卷轴上准备运往组装厂需要几个月的时间。客户的订单将以不同的速度转移,造成需求的高峰和低迷,芯片制造商无法轻易做出反应。在互联网萧条之后,一些供应商在制造过程中将未完成的晶圆转移到氮气储存中,在返回晶圆厂完成之前,船上的芯片不会降解。当面临需求高峰时,他们的选择更少:即使有专门的生产,订购的任何东西也无法在不到三个月的时间内出现。

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