机译:Materials for interconnects
Penn State Univ, University Pk, PA 16802 USA;
Rensselaer Polytech Inst, Troy, NY 12181 USA;
Univ Notre Dame, Dept Elect Engn, Notre Dame, IN 46556 USAYale Univ, Dept Mech Engn & Mat Sci, New Haven, CT 06520 USAPurdue Univ, W Lafayette, IN 47907 USA;
Microelectronics; Cu; Electronic structure; 2D materials; Topological;