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Vat photopolymerization 3D printing of thermal insulating mullite fiber-based porous ceramics

机译:还原光聚合3D打印保温莫来石纤维基多孔陶瓷

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摘要

To satisfy the eagerness for mullite fiber-based porous ceramics (Muf-based porous ceramics) with complex geometries in high-temperature thermal insulation fields, vat photopolymerization three-dimensional (3D) printing was first employed to prepare the highly complex Muf-based porous ceramics. Herein, a photosensitive hydroxysiloxane HPMS-KH570 was employed as the resin matrix, which not only prevented the fiber agglomeration and improved the rheological properties of the slurries but also acted as a high-temperature binder to fix the fiber cross points after sintering and consequently improved the structural stability of the 3D-Muf-based porous ceramics. The effects of mullite fiber (Muf) aspect ratio and content on the performance of Muf slurries, microstructure and physical properties of the 3D-Muf-based porous ceramics were investigated. When the fiber aspect ratio was 45 and the fiber content was 6.67 vol%, the Muf slurry exhibited the most suitable properties for vat photopolymerization 3D printing, and the corresponding 3D-Muf-based porous ceramics exhibited a well-defined 3D printed lattice structure with struts consisting of randomly crisscrossing Muf. This unique 3D skeleton structure endowed the 3D-Muf-based porous ceramics with low density (0.47 g/cm~3) and low room temperature thermal conductivity (0.11 W/(m·K)), enabling it a promising candidate for high-temperature (1000-1400℃) insulation materials. Furthermore, this printing strategy provided references for vat photopolymerization 3D printing of other fiber-based materials.
机译:为莫来石光纤满足的渴望多孔陶瓷(Muf-based多孔陶瓷)在高温热复杂的几何图形绝缘领域,增值税光聚合三维(3 d)印刷术采用高度复杂Muf-based做准备多孔陶瓷。hydroxysiloxane HPMS-KH570被雇佣树脂矩阵,这不仅防止纤维集聚和改善流变泥浆还充当了的属性高温粘结剂修复纤维交叉点后烧结,因此提高3 d-muf-based的结构稳定性多孔陶瓷。(Muf)长宽比和内容的性能的Muf泥浆,微观结构和物理3 d-muf-based多孔陶瓷的属性被调查。45,纤维含量是6.67卷%,Muf泥浆表现出最合适的属性对增值税光聚合3 d打印技术,对应3 d-muf-based多孔陶瓷表现出一个定义良好的3 d打印晶格使用struts组成的随机结构Muf投递。赋予3 d-muf-based多孔结构陶瓷与低密度(0.47克/厘米~ 3)和低室温导热系数(0.11W / (m·K)),使它有前途的候选人高温(1000 - 1400℃)绝缘材料。为增值税光聚合提供了参考3 d打印其他光纤材料。

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