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Laser-assisted arthroscopic ulnar shortening.

机译:激光辅助关节镜尺缩短。

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摘要

The purpose of this study is to evaluate arthroscopic ulnar shortening with the holmium:yttrium-aluminum-garnet (Ho:YAG) laser for the treatment of ulnocarpal abutment syndrome (UAS). This is a retrospective review of the experience of a single surgeon using this technique between 1994 and 2000. Unloading the ulnocarpal joint is the recognized treatment of UAS. Ulnar shortening via a diaphyseal osteotomy and plating (USO) has been used with good results; however, nearly 50% of patients will require hardware removal. Researchers have reported similar results between open distal ulnar resection (the wafer procedure) and USO for the treatment of UAS. Researchers have also reported similar results with mechanical arthroscopic distal ulnar resections (arthroscopic wafer distal ulnar resection [AWP]) for UAS. Eleven patients who underwent Ho:YAG laser-assisted arthroscopic distal ulnar resection were retrospectively evaluated. The average follow-up time was 31 months, with a range of 7 to 61 months. Evaluation using Darrow' s criteria revealed 64% excellent (7 of 11), 18% good (2 of 11), 9% fair (1 of 11), and 9% poor (1 of 11) results. The average return to work time was 4.7 months, with a range of 1.5 to 16 months. Complications included 1 repeat surgery for ulnocarpal scar formation, 2 cases of transient tendonitis, and 1 portal site erythema without drainage that was treated with antibiotics. One patient (the one with a poor result) has not returned to work for unrelated reasons. chi- square analysis (P <.05) was unable to identify a statistical difference between the reported results of arthroscopic wafer procedures, USOs, and open wafer procedures. We concluded that Ho:YAG laser-assisted arthroscopic ulna shortening procedures show similar results to those reported for arthroscopic wafer procedures, open wafer procedures, and USOs. Return to work times are similar to those reported by other researchers, as is the return to preoperative occupation rate. There is no need for late removal of hardware, as is sometimes associated with USO. Our experience has been that the Ho:YAG laser removes hyaline cartilage and subchondral bone rapidly and with little debris, and thus facilitates the ulna shortening procedure.
机译:本研究的目的是评估关节镜尺缩短的钬:名叫(Ho:掺钕钇铝石榴石激光治疗ulnocarpal桥台综合症(UAS)。使用这一个外科医生的经验1994年和2000年之间的技术。ulnocarpal联合是公认的治疗“无人飞行系统”。和镀(USO)已经使用好结果;需要硬件删除。报告了类似的结果之间开放的远端尺骨USO切除(晶片过程)和为“无人飞行系统”的治疗。与机械报告了类似的结果关节镜远端尺切除术(关节镜晶片远端尺侧切除(用))“无人飞行系统”。激光辅助关节镜远端尺切除术进行回顾性评价。31个月,平均随访时间时7 - 61个月。标准显示64%优秀11 (7),18%11(2)好,9%的公平11(1),和9%的贫穷(111)的结果。4.7个月,一系列的1.5到16个月。重复手术并发症包括1瞬态ulnocarpal疤痕形成,2例肌腱炎,1门户网站红斑排水使用抗生素治疗。与一个贫穷的病人(结果)回到工作岗位无关的原因。广场分析(P < . 05)无法识别统计报告的区别结果关节镜晶片过程、uso和开放的晶片过程。何:掺钕钇铝石榴石激光辅助关节镜尺骨缩短程序显示类似的结果这些报道关节镜晶片程序,晶片程序,和uso开放。次被其他类似报道研究人员,恢复到术前占领率。删除硬件,有时是相关联的与USO激光去除透明软骨和软骨下骨骼迅速和小碎片,因此促进尺骨缩短过程。

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