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Ultra-high drivability, high-mobility, low-voltage and high-integration intrinsically stretchable transistors

机译:超高驾驶性能、高机动、低压和高整合本质上可伸缩晶体管

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摘要

Realizing intrinsically stretchable transistors with high current drivability, high mobility, small feature size, low power and the potential for mass production is essential for advancing stretchable electronics a critical step forward. However, it is challenging to realize these requirements simultaneously due to the limitations of the existing fabrication technologies when integrating intrinsically stretchable materials into transistors. Here, we propose a removal-transfer-photolithography method (RTPM), combined with adopting poly(urea-urethane) (PUU) as a dielectric, to realize integratable intrinsically stretchable carbon nanotube thin-film transistors (IIS-CNT-TFTs). The realized IIS-CNT-TFTs achieve excellent electrical and mechanical properties simultaneously, showing high field-effect-mobility up to 221 cm(2) V-1 s(-1) and high current density up to 810 mu A mm(-1) at a low driving voltage of -1 V, which are both the highest values for intrinsically stretchable transistors today to the best of our knowledge. At the same time, the transistors can survive 2000 cycles of repeated stretching by 50%, indicating their promising applicability to stretchable circuits, displays, and wearable electronics. The achieved intrinsically stretchable thin-film transistors show higher electrical performance, higher stretching durability, and smaller feature size simultaneously compared with the state-of-the-art works, providing a novel solution to integratable intrinsically stretchable electronics. Besides, the proposed RTPM involves adopting removable sacrificial layers to protect the PDMS substrate and PUU dielectric during the photolithography and patterning steps, and finally removing the sacrificial layers to improve the electrical and mechanical performance. This method is generally applicable to further enhance the performance of the existing transistors and devices with a similar structure in soft electronics.
机译:本质上实现可伸缩的晶体管当前的驾驶性能,高机动性高,小的特征尺寸、低功率和潜力为推进大规模生产是至关重要的柔性电子的关键一步。然而,挑战意识到这些同时由于需求现有的制造的局限性技术集成本质上时可伸缩材料晶体管。提出一个removal-transfer-photolithography方法(RTPM),结合采用保利(urea-urethane)(噗)作为介质,实现integratable本质上可伸缩碳纳米管薄膜晶体管(IIS-CNT-TFTs)。优秀的电气和机械性能同时,高field-effect-mobility 221 cm(2)与它们年代(1)和高电流密度高达810μA毫米(1)低驱动电压的1 V,这都是最高价值本质上是可伸缩的晶体管今天我们所知。同时,晶体管可以生存2000次的反复拉伸50%,来显示他们的前途的适用性柔性电路、显示器和可穿戴电子产品。柔性薄膜晶体管显示更高电气性能、更高的拉伸耐用性和更小的特征尺寸同时与最先进的工作,为integratable提供一个新颖的解决方案本质上可伸缩的电子产品。拟议中的RTPM涉及采用可拆卸的牺牲层保护PDMS基片在光刻和噗介质和模式的步骤,最后删除提高电气和牺牲层机械性能。适用于进一步增强的性能现有的晶体管和设备类似的结构软电子产品。

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