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首页> 外文期刊>Journal of nuclear engineering and radiation science >Effect of Sequential Helium and Nickel Ion Implantation on the Nano-Indentation Hardness of X750 Alloy
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Effect of Sequential Helium and Nickel Ion Implantation on the Nano-Indentation Hardness of X750 Alloy

机译:顺序氦气和镍离子注入对X750合金纳米缩进硬度的影响

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摘要

Sequential He+ and Ni+ implantations were performed to investigate their combined effect on the indentation hardness of heat-treated X750 alloy. The microstructure of the ion-implanted region was also characterized with transmission electron microscope (TEM). The X750 alloy displayed a pronounced softening with vet), low Ni+ implantation levels, psi = 0.01-1.0 dpa, however it showed a clear increase in hardness when implanted with He+ up to C-He = 5000 appm. Samples subjected to sequential He+ and Ni+ implantations displayed hardness values between those presented by sole He+ or Ni+ implantation suggesting that the effects of ion-induced microstructural damage and helium accumulation on the hardness of this alloy can be considered as independent and additive over the range of conditions studied. This observation is in contradiction to previously reported TEM-based studies, which suggest that accumulated helium slows the dissolution/disordering of the gamma' hardening phase in this alloy. In our study, established theories were applied to assess the contribution of ion-induced defect clustering, gamma' precipitate disordering, and helium bubble accumulation to the hardness of the X750 alloy. It was observed that generation of ion-induced defect clusters and the formation of helium bubbles increased the indentation hardness slightly while the disordering of gamma' precipitates resulted in a dramatic decrease in the total hardness. Ni+ and He+ implantation also had different effects on the depth dependence of the indentation hardness indentation size effect (ISE). The ISE was pronounced in the samples subjected to only Ni+ implantation while it was almost absent in samples subjected to only He+ implantation.
机译:连续进行He+和Ni+植入,以研究它们对热处理X750合金压痕硬度的综合影响。用透射电子显微镜(TEM)对离子注入区的微观结构进行了表征。X750合金在低镍离子注入水平下表现出明显的软化,psi=0.01-1.0 dpa,但在注入高达C-He=5000 appm的He+时,硬度明显增加。经过连续He+和Ni+注入的样品显示的硬度值介于单独He+或Ni+注入的硬度值之间,这表明在研究的条件范围内,离子诱导的微观结构损伤和氦积累对该合金硬度的影响可被视为独立的和加性的。这一观察结果与之前报道的基于TEM的研究相矛盾,后者表明累积的氦减缓了该合金中伽马硬化相的溶解/无序化。在我们的研究中,已建立的理论被应用于评估离子诱导缺陷聚集、γ沉淀无序化和氦气泡积聚对X750合金硬度的贡献。观察到离子诱导缺陷团簇的产生和氦气泡的形成使压痕硬度略有增加,而γ沉淀的无序化导致总硬度显著降低。镍离子和氦离子注入对压痕硬度-压痕尺寸效应(ISE)的深度依赖性也有不同的影响。ISE在仅接受Ni+注入的样品中显著,而在仅接受He+注入的样品中几乎不存在。

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