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首页> 外文期刊>Journal of Materials Engineering and Performance >Effect of Various Thermal Treatments and Cu Contents on Precipitation Mechanism, Martensitic Growth, and Cold Workability of Ti50Ni50-xCux Ternary Shape Memory Alloys
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Effect of Various Thermal Treatments and Cu Contents on Precipitation Mechanism, Martensitic Growth, and Cold Workability of Ti50Ni50-xCux Ternary Shape Memory Alloys

机译:各种热处理和Cu含量对Ti50Ni50-Xcux三元形状记忆合金沉淀机理,马氏体生长和冷加工性的影响

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摘要

Ti50Ni50-xCux (x = 10, 15, 20, 25) ternary shape memory alloys (SMAs) were developed in an arc melting furnace and characterized by differential scanning calorimetry (DSC), atomic force microscopy (AFM), scanning electron microscopy (SEM), and x-ray diffraction (XRD) techniques. The transformation temperatures and thermal hysteresis showed a decreasing trend with the successive addition of Cu. The SEM and XRD results showed the formation of nano-scaled Ti(Ni,Cu)(2) type precipitates along with small densities of Ti2Ni type precipitates. The precipitation of fine Ti(Ni,Cu)(2) type precipitates was found to be sensitive toward the presence of lattice defects. It is expected that in TiNiCu based SMAs, the precipitation mechanism of Ti(Ni,Cu)(2) type precipitates depends upon the relative ease of diffusion of Cu toward the heterogeneous nucleation sites provided by the lattice defects. Surface topographic characteristics of the alloys were also investigated by the AFM. The AFM results showed that the fine acicular martensite structure transformed to coarser acicular martensite with successive addition of Cu followed by different thermal treatments. Hardness showed direct correlation with the Cu content and the thermal treatment employed, whereas cold workability was shown to decrease with the successive addition of Cu in TiNiCu based SMAs.
机译:在电弧炉中制备了Ti50Ni50 xCux(x=10,15,20,25)三元形状记忆合金(SMA),并用差示扫描量热法(DSC)、原子力显微镜(AFM)、扫描电子显微镜(SEM)和x射线衍射(XRD)技术对其进行了表征。随着Cu的加入,相变温度和热滞回线呈下降趋势。SEM和XRD结果表明,纳米Ti(Ni,Cu)(2)型沉淀的形成伴随着Ti2Ni型沉淀的小密度。细Ti(Ni,Cu)(2)型析出物的析出对晶格缺陷的存在很敏感。预计在TiNiCu基SMA中,Ti(Ni,Cu)(2)型沉淀的沉淀机制取决于Cu向晶格缺陷提供的异质形核位置扩散的相对容易程度。用原子力显微镜研究了合金的表面形貌特征。原子力显微镜(AFM)结果表明,随着连续添加铜,然后进行不同的热处理,细针状马氏体组织转变为粗针状马氏体。硬度与铜含量和热处理直接相关,而在TiNiCu基SMA中连续添加铜后,冷加工性降低。

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