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Enhancement of Process Capabilities and Numerical Prediction of Geometric Profiles and Global Springback in Incrementally Formed AA 1050 Sheets

机译:增强过程能力和几何简档的数值预测和逐步形成的AA 1050张的全局回弹

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摘要

In single point incremental forming (SPIF) process, parts suffer from dimensional inaccuracy and limited formability, mainly, due to occurrence of springback and abrupt fracture, respectively. Orientation imaging microscopy of the original AA1050 sheet revealed dislocated and distorted microstructure and texture in comparison to the same sheet preheated at different temperatures. The objective of this work is to investigate formability and geometrical accuracy due to variations in microstructure and texture of the sheet and to propose a methodology, which can predict the geometric profiles and springback effect at different preheating temperatures. The work reports enhanced formability and geometrical accuracy of parts formed by SPIF, owing to the reformation of grain structure due to preheating. However, preheating at higher temperatures, i.e., 330 and 500?°C deteriorated the surface quality, as homogenization of grain orientation led to orange peel effect. The proposed methodology, based on reverse engineering and numerical formulation, is capable of predicting two-dimensional cone and pyramid profiles as well as global spring back values associated with different preheating temperatures. The results predicted by proposed method were validated by experiments and could be implemented to enhance the accuracy of SPIF process.
机译:在单点渐进成形(SPIF)过程中,零件的尺寸不准确和成形性有限,主要是由于回弹和突然断裂的发生。与在不同温度下预热的相同板材相比,原始AA1050板材的取向成像显微镜显示出错位和扭曲的微观结构和纹理。这项工作的目的是研究由于板材微观结构和织构的变化而产生的成形性和几何精度,并提出一种方法,该方法可以预测不同预热温度下的几何轮廓和回弹效应。该工作报告了由于预热导致晶粒结构的改变,SPIF成形零件的成形性和几何精度得到了提高。然而,在较高温度下预热,即330和500?摄氏度恶化了表面质量,因为晶粒取向的均匀化导致了橘皮效应。所提出的方法基于逆向工程和数值公式,能够预测二维锥体和金字塔轮廓以及与不同预热温度相关的整体回弹值。通过实验验证了该方法的预测结果,可以提高SPIF过程的精度。

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