Thermal Decomposition Kinetic Analysis and Performance Characterization of Low D-k/D-f Ink based on Polyurethane Acrylate

摘要

Thermal analysis and Fourier transform infrared spectroscopy were used to investigate the thermal stability of two low-dielectric constant (D-k)/dielectric loss (D-f) inks based on polyurethane acrylate. According to Arrhenius law, the Flynn-Wall-Ozawa method was used to calculate the apparent activation energy (as the standard apparent activation energy E-0) of the ink film at weight loss rates were 10, 50 and 70% for the evaluation of its thermal aging performance. Results show that the activation energy of the ink compounded with acrylic fluorocarbon resin and polyurethane acrylate is relatively high. The Aehar-Brindey-Sharp-Wend-Worth differential method was used to analyze the most probable mechanism function of the ink film layer. The first, second, and third segments of the thermal decomposition temperature of the ink film are speculated to range from 126 to 247 degrees C, from 247 to 384 degrees C (follows the 3d diffusion model, and from 384 to 508 degrees C (third-order chemical reaction), respectively. This article provides theoretical reference for the formulation design of 5G ink from the perspective of thermal decomposition mechanism and thermal stability.