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A particle debonding model considering interface nanoscale damage effect

机译:考虑接口纳米级损伤效果的粒子剥离模型

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摘要

The debonding of the inclusions or second phase particles from matrix which is controlled by energy and stress condition is an important source of voids nucleation in engineering materials. In this paper, firstly it is confirmed that energy condition for debonding can easily be satisfied for micron scale particles in plastic deformation by numerical simulation; then a stress controlled debonding model introducing the effect of nanoscale damage of the interface is proposed; then the parameters of the model are determined by fitting the published experimental data. Unlike traditional debonding models, the proposed model can reasonably predict the size effect that the debonding strain will increase with the decrease of particle size at micron scale, which was observed by experiments.
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