首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Improving the thermal expansion behavior and damping capacity of C/SiC composites by heat treatment
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Improving the thermal expansion behavior and damping capacity of C/SiC composites by heat treatment

机译:通过热处理改善C / SiC复合材料的热膨胀行为和阻尼能力

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The present study proposes the heat treatment method to optimize the coefficient of thermal expansion (CTE) and damping capacity of 2D C/SiC composites. Results demonstrated that CTE increased monotonically with measuring temperature and could be tuned in a wide range from 2.16 x 10(-6) to 0.48 x 10(-6) K-1 at 200 degrees C by controlling the HT temperature. CTE decreased significantly at HT temperatures below 1700 degrees C and remained constant above that value and up to 1900 degrees C. The damping capacity of C/SiC composites could be improved by increasing HT temperature up to 1700 degrees C by introduction of thermally-induced microcracking phenomena; thereafter further increase in HT temperature did not contribute to damping. Matrix microcracking due to heat treatment also relaxed the residual stress state of the material by counteracting part of the matrix extension through propagation inside the composites hence contributing to dissipation of imposed vibration energy. A HT temperature value of 1700 degrees C was identified as critical for the total relaxation of thermal stresses; further increase in HT temperature failed to create more microcracks. (C) 2020 Elsevier B.V. All rights reserved.
机译:本研究提出了优化2D C/SiC复合材料热膨胀系数(CTE)和阻尼能力的热处理方法。结果表明,随着测量温度的升高,热膨胀系数单调增加,通过控制高温温度,热膨胀系数可以在200℃时在2.16×10(-6)到0.48×10(-6)K-1的范围内调节。当高温温度低于1700摄氏度时,热膨胀系数显著降低,并在高于该值和1900摄氏度时保持不变。通过引入热致微裂纹现象,将高温温度提高到1700摄氏度,可以提高C/SiC复合材料的阻尼能力;此后,高温温度的进一步升高对阻尼没有贡献。热处理导致的基体微裂纹也会通过抵消复合材料内部传播的部分基体延伸,从而缓解材料的残余应力状态,从而有助于耗散施加的振动能量。1700℃的高温值被认为是热应力完全松弛的关键;高温处理温度的进一步升高未能产生更多的微裂纹。(C) 2020爱思唯尔B.V.版权所有。

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