Development of a non-contact current distribution measurement technique for LSI packagings on PCBs

摘要

As a technique for measuring high-frequency currents flowing through LSI pins, a non-contact detecting method for current distribution based on measurements of the near magnetic field distribution is investigated. The proposed technique draws the current distribution through iterative pattern matching between a measured near magnetic field distribution and the calculated from the assumed currents. By filtering with the layout data and iteratively converging on a solution, discrepancy between the magnetic field distribution by the obtained current and the measured magnetic field distribution becomes minimal. The proposed technique has a positional resolution of 0.5mm and realizes non-contact measurement of LSI pin currents.