首页> 外文期刊>鉄と鋼/Journal of the Iron and Steel Institute of Japan. >Effect of heat treatment on bonding characteristics and interfacial microstructures in explosively welded Ti/SUS430 stainless steel clad
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Effect of heat treatment on bonding characteristics and interfacial microstructures in explosively welded Ti/SUS430 stainless steel clad

机译:热处理对易于焊接Ti / SUS430不锈钢包层粘合特性和界面微结构的影响

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摘要

Effect of heat treatment on bonding characteristics and interfacial microstructures in explosively welded titanium/SUS430 ferrite stainless steel clad was investigated. The average shear strength of the clad annealed at 1073K for 3.6 ks was 338MPa and was equivalent to about 60% of that of an as-welded clad. The strength of the clad annealed at 1073K gradually decreased to 242 MPa with increasing holding time up to 360 ks. The same tendency was obtained from the clad annealed at 1173K. On theother hand, the strength of the clad annealed at 1273K drastically decreased to 107MPa with increasing holding time up to 360ks. The clad annealed at 1073 and 1173K yielded TiC layer at the bonding interface, while the reaction layer in the clad annealed1273K consisted of TiC, FeTi, Fe{sub}2Ti and X (Fe{sub}29Cr{sub}13Ti{sub}8) from titanium side. It was noted that chromium existed in the Fe{sub}2Ti , which has wide solubility limit for chromium, and X compounds formed at the SUS430 side. The TiC layerin the former dads acts as a barrier for diffusion of titanium, iron and chromium across the bonding interface and prevents the growth of intermetallic compounds. The clad formed TiC layer at the bonding interface preserved high bonding strength evenafter prolonged annealing.
机译:研究了热处理对粘接特性和界面焊接钛/ SUS430铁氧体不锈钢包层中粘接特性和界面微结构的影响。在1073K上为3.6 ks退火的包层的平均剪切强度为338MPa,相当于AS焊接包层的约60%。在1073K上退火的包层的强度逐渐降低至242MPa,随着360 ks的增加。从1173K的包层退火获得相同的趋势。在其他手中,在1273K上退火的包层的强度会急剧下降至107MPa,随着保持时间高达350k。在1073和1173k处退火的包层在粘合界面处产生TiC层,而Clad退火的反应层1273K由Tic,Feti,Fe {sub} 2Ti和x(Fe {sub} 29cr {sub} 8组成。 )来自钛侧。有人指出,在SUS430侧形成的Fe {Sub} 2Ti中存在铬的Fe {sub} 2Ti中的溶解度极限。前爸爸的TiC层素充当钛,铁和铬在粘合界面上扩散并防止金属间化合物的生长。粘接界面处的包层形成的TiC层保持高粘合强度甚至延长退火。

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