Thermal Design Technology for Small and Slim Notebook PCs

摘要

In order to realize PCs with high performanceand mobility, it is necessary to package a high-speed CPUand other components in a small and slim case whileproviding the maximum functions possible. An importantissue in achieving these objectives is solving the thermalproblem, since components that generate high heat flux arepackaged at high density and the temperature of the PCrises. Thermal design technology therefore plays asignificant role in reducing the development cycle time.We have investigated thermal and fluid flow by numericalsimulation and developed a thermal design technology thatcan be used to estimate thermal properties at an early designstage. This technology has contributed to the development ofslim notebook PCs including the Libretto series, as well asother high-performance PCs equipped with the Pentium III processor.