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Physical and mechanical properties of bamboo wastage cement bonded board

机译:竹浪涌水泥粘结板的物理和力学性能

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The study was conducted to evaluate the properties of cement bonded board made from bamboo wastage chips. Without giving any treatment, the ratio of bamboo wastage chips and cement were 20:80, 30:70, 40:60 and each of them having pressing time of 6, 12 and 24 h. Important physical and mechanical properties were tested and analyzed. Physical properties such as density, moisture content, water absorption and linear expansion were better than those reported in the literature. However, mechanical properties such as MOR and MOE were found lower compared with the values reported by other researchers. The board for the ratio of bamboo wastage chips and cement, 20:80 at 24 h pressing time showed the best performance for both the physical and mechanical properties. The density of the board at 24 h pressing time for 20:80, 30:70 and 40:60 boards was 1.80, 1.48 and 1.07 g/cm3 respectively. The MOE was 310, 295 and 210 N/mm2 were respectively for the ratio of 20:80, 30:70 and 40:60 at the pressing time 24 h. The properties of bamboo wastage cement bonded board indicate for the use of bamboo wastages economically using them in cement bonded parti-cleboard industry.
机译:进行该研究以评估由竹浪费芯片制成的水泥粘结板的性能。在不给予任何处理的情况下,竹浪费芯片和水泥的比例为20:80,30:70,40:60,并且每个挤压时间为6,12和24小时。测试和分析了重要的物理和机械性能。密度,水分含量,吸水和线性膨胀等物理性质优于文献中报道的那些。然而,与其他研究人员报告的值相比,诸如Mor和Moe的机械性能下降。竹浪费与水泥的比例,20:80在24 H压制时间上显示出物理和机械性能的最佳性能。电路板的密度在24 H压制时间为20:80,30:70和40:60板分别为1.80,1.48和1.07g / cm 3。 MOE分别为310,295和210n / mm2,在按压时间24小时的比例为20:80,30:70和40:60。竹浪费水泥粘结板的性质表明,在水泥粘结的Partlbloblble行业中使用它们在经济上使用竹子浪费。

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