Investigation of Heat Transfer of Electronic System through Utilization of Novel Computation Algorithms

摘要

Looking towards modern electronic development, it can be seen that tendencies are focused on efficiency and reliability. Simultaneously higher integration and minimization of electronic systems are more and more utilized almost in every industrial and commercial sphere. Together with these phenomenons the higher emphasis has to be putted on the thermal management of modern electronics. Manufacturers of semiconductor devices are targeting optimal thermal properties of their devices in the way of utilization of modern materials, technologies, or packaging processes. Thinking about complex electronic system, it is necessary to focus almost on proper design of thermal management in post-prototype stage. This is also due to fact that each consumer's electronic device has to fulfill special international electronic standards, mainly from the EMC and thermal point of view. The optimization process of heat transfer can be based on experimental verification of proposed system or a special computation technique, which will be able to determine the temperature distribution can be utilized. First technique (experimental) is mostly time consuming due to repeatable test after each modification of functional sample (geometry reassembly, utilization of different materials - PCB, devices etc.). Therefore targeting accurate and fast optimization process, the computation algorithm of heat distribution seems to be better solution. The only need is design of COMSOL simulation model, which is multiphysics software based on FEM analysis methodology [1-4]. In this paper we will present process of development of computation algorithm, which is designed in MATLAB software. Two possible approaches will be shown, whereby first will be based on resistance matrix computation (algorithm implemented into m-file), and second on COMSOL - Simulink interface.