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首页> 外文期刊>Journal of Materials Science >Mechanical and thermal properties of low temperature sintered silicon carbide using a preceramic polymer as binder
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Mechanical and thermal properties of low temperature sintered silicon carbide using a preceramic polymer as binder

机译:使用陶瓷陶瓷作为粘结剂的低温烧结碳化硅的机械和热性能

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Silicon carbide is used for a variety of applications, however, sintering still remains a challenge due to the high temperature and pressure required as well as the need for sintering aids. The use of preceramic polymers as binder is a promising technique for pressureless low-temperature sintering of SiC without sintering aids. However, the mechanical and thermophysical properties as well as the microstructure of bodies sintered through this technique has not been extensively documented. One of the main polymers which has gained attention in the past few years as a SiC preceramic is allylhydridopolycarbosilane (AHPCS). Here, using AHPCS as binder, silicon carbide pellets were sintered at temperatures as low as 930 A degrees C, and the microstructural, mechanical, and thermophysical property characterization is presented. Compared to conventionally sintered SiC, the material shows similar fracture toughness, lower hardness, strength, and thermal conductivity. The observed properties are explained as a result of residual porosity combined with amorphous SiC at the grain boundaries.
机译:碳化硅用于多种应用,然而,由于所需的高温和高压以及对烧结助剂的需求,烧结仍然是一个挑战。在不使用烧结助剂的情况下,使用预陶瓷聚合物作为粘结剂是一种有前途的技术,可用于SiC的无压低温烧结。然而,尚未广泛记录通过该技术烧结的物体的机械和热物理性质以及微观结构。近年来,作为SiC预陶瓷而受到关注的主要聚合物之一是烯丙基氢化聚碳硅烷(AHPCS)。在这里,使用AHPCS作为粘合剂,在低至930 A的温度下烧结碳化硅粒料,并给出了微观结构,机械和热物理性质表征。与常规烧结的SiC相比,该材料具有相似的断裂韧性,较低的硬度,强度和导热性。观察到的性能是由于残余孔隙率与晶界处无定形SiC结合而造成的。

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