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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Effect of annealing temperatures on microstructure of (Zr_(0.8)Sn_(0.2))TiO_4 thin films grown by a sol-gel process
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Effect of annealing temperatures on microstructure of (Zr_(0.8)Sn_(0.2))TiO_4 thin films grown by a sol-gel process

机译:退火温度对溶胶-凝胶法生长(Zr_(0.8)Sn_(0.2))TiO_4薄膜微观结构的影响

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摘要

The impact of annealing temperatures on microstructures of zirconium tin titanate (Zr_(0.8)Sn_(0.2)TiO_4, ZST) thin films grown by a sol-gel process is proposed. ZST thin films were deposited along the (100) orientation p-type Si substrate and were characterized by XRD, AFM, SIMS and TEM. Amorphous and polycrystal films were grown successfully on Si substrates with different annealing temperatures. The chemical compositions of the films were detected and showed a uniform concentration distribution for all species. Due to the interface layer formed during the annealing process, the dielectric constants of 81-nm-thick ZST films in the present study were approx 16.
机译:提出了退火温度对通过溶胶-凝胶法生长的钛酸锆锡薄膜(Zr_(0.8)Sn_(0.2)TiO_4,ZST)的微观结构的影响。沿(100)取向p型Si衬底沉积ZST薄膜,并通过XRD,AFM,SIMS和TEM对其进行表征。在不同退火温度的硅衬底上成功地生长了非晶和多晶膜。检测膜的化学组成,并显示所有物种的浓度分布均匀。由于在退火过程中形成了界面层,因此本研究中81nm厚的ZST薄膜的介电常数约为16。

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