A new method of high-quality silica filmsproduction by catalytic plasma anodizing of silicon with surfaceradiation defects introduced by preliminary ion implantation hasbeen proposed. It was shown, that in this way it is possible toreduce a temperature of the process down to 423 K as well as toincrease significantly the process rate and effectiveness. Effectof near the surface radiation defects on the kinetics of plasmaanodizing process is explained.
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