Microstructure and Thermal Conductivity of SiCp/Cu Heat Sink Materials

摘要

In a given work, Cu-(30, 40, 50} vol. percent SiCp heat-sink materials were fabricated by hot pressing with Cu-coated and imcoated SiC powder, respectively. The microstructure and thermal conductivity of heat-sink materials were studied. Results showed that SiC particles are distributed homogeneously in heat-sink materials, and the interface between SiCp particles and a Cu matrix was clear and well bonded. Surface treatment of SiC particles and vacuum could improve thermal conductivity of heat-sink materials. The important reference data are provided for the future experiments.