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Development of 60-GHz-band dielectric waveguide filter and investigation of flip-chip package structure

机译:60 GHz频带介质波导滤波器的开发和倒装芯片封装结构的研究

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摘要

A planar dielectric waveguide filter with CPW I/O ports suitable for flip-chip bonding is proposed and is demonstrated for 60-GHz-band applications. The filter is formed incorporating metalized through holes in an alumina substrate. In order to improve stop-band rejection, short-circuited CPW resonators with a half wavelength are added to waveguide-to-CPW transitions. A fabricated 4-resonator filter exhibits an insertion loss of 3.2 dB with a 3 dB-bandwidth of 3.0 GHz at a center frequency of 59.5 GHz. The filter is mounted by using flip-chip bonding in a multi-layer ceramic package with a structure to suppress parasitically propagating electromagnetic waves. The flipped filter shows a stop-band rejection better than 35 dB from 50 GHz to 80 GHz.
机译:提出了一种具有CPW I / O端口的平面介电波导滤波器,该滤波器适用于倒装芯片键合,并已针对60 GHz频段应用进行了演示。形成的过滤器在氧化铝基板中结合了金属化的通孔。为了改善阻带抑制,将具有一半波长的短路CPW谐振器添加到波导到CPW的过渡中。在中心频率为59.5 GHz时,制造的4谐振滤波器显示出3.2 dB的插入损耗和3.0 GHz的3 dB带宽。通过使用倒装芯片接合将滤波器安装在具有抑制寄生传播的电磁波的结构的多层陶瓷封装中。翻转后的滤波器在50 GHz至80 GHz范围内的阻带抑制性能优于35 dB。

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