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Grinding of alumina/aluminum composites

机译:氧化铝/铝复合材料的研磨

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With the anticipated widespread usage of metal matrix composites (MMCs) in the near future, the machinability of high performance MMCs needs to be understood. This paper reports research results obtained from the grinding of aluminium-based MMCs reinforced with Al_2O_3 particles using grinding wheels having SiC in a vitrified matrix and diamond in a resin-bonded matrix. The issues discussed are surface roughness, grinding force, type and size of the abrasives, grinding conditions, and the consequential sub-surface integrity. The study used grinding speeds of 1100-2200 m/min, a grinding depth of 15 mu m for rough grinding and 1 mu m for fine grinding, and cross-feeds of 3 and 1 mm for rough and fine grinding respectively, while maintaining a constant table feed-rate of 20.8 m/min. The surface integrity of the ground surfaces and sub-surfaces were analyzed using a scanning electron microscope (SEM) and a profilometer. The surface finish values, R_a, were scattered in the range 0.15-0.70 mu m for the rough-ground samples, whilst a narrower range of 0.20-0.35 mu m was achieved for the fine-ground samples. Smearing of aluminium on the ground surfaces was seen for rough grinding, but was negligible for fine grinding because all the Al_2O_3 particles of the ground surfaces were clearly visible when observed with the SEM. Grinding using a 3000-grit diamond wheel at depth of cut of 1 mu m produced many ductile streaks on the Al_2O_3 particles. Both the Al_2O_3 particles and aluminum matrix were removed by micro machining. There were no cracks and defects found on the ground surfaces. There was almost no sub-surface damage, except for a rare cracked particle being found. Rough grinding with a SiC wheel followed by fine grinding with a fine-grit diamond wheel is recommended for the grinding of alumina/aluminum composites.
机译:随着金属基复合材料(MMC)在不久的将来的广泛使用,需要了解高性能MMC的可加工性。本文报道了使用含碳化硅的陶瓷砂轮和结合树脂的金刚石砂轮对由Al_2O_3颗粒增强的铝基MMC进行研磨获得的研究结果。讨论的问题是表面粗糙度,磨削力,磨料的类型和尺寸,磨削条件以及相应的亚表面完整性。该研究使用的研磨速度为1100-2200 m / min,粗磨的研磨深度为15μm,精磨的研磨深度为1μm,粗磨和精磨的交叉进给分别为3和1 mm,同时保持恒定工作台进给速度为20.8 m / min。使用扫描电子显微镜(SEM)和轮廓仪测量地表和次表面的表面完整性。对于粗糙研磨的样品,表面光洁度值R_a分散在0.15-0.70μm的范围内,而对于精细研磨的样品,其表面粗糙度R_a的较窄范围为0.20-0.35μm。粗磨时可以看到铝表面上的污迹,而细磨时可以忽略不计,因为当用SEM观察时,所有表面的Al_2O_3颗粒都清晰可见。使用3000粒度的金刚石砂轮在1μm的切削深度下进行研磨会在Al_2O_3颗粒上产生许多延展性条纹。通过微机械加工去除Al_2O_3颗粒和铝基体。在地面上没有发现裂纹和缺陷。除了发现了罕见的裂纹颗粒外,几乎没有表面下的损坏。对于氧化铝/铝复合材料的研磨,建议先用SiC砂轮粗磨,再用细砂轮进行细磨。

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