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Novel enhanced magnetron sputtering system

机译:新型增强型磁控溅射系统

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摘要

Magnetron sputtering is the process of choice for the deposition of a wide range of industrially important coatings. However, current processes have inherent limitations. In particular, the energy delivered to the growing film, the mass flux and the ion to atom ratio incident at the substrate, which have a profound effect on coating properties, cannot be readily varied using present technology. Consequently, film properties may not be optimal. In order to overcome these limitations, studies are being made of an enhanced sputtering system, in which alternative plasma sources have been incorporated into an otherwise standard magnetron sputtering system. The new system combines a gridless linear ion source (LIS) and a conventional magnetron to form a variable energy charge flux magnetron sputtering system (termed M-LIS). Detailed characterisation studies of this system were carried out and are reported here. Included are models of the magnetic field in the system, performance data of the M-LIS in different modes of operation and the impact of this source on the structure and properties of metallic and ceramic coatings. The relation between the energy delivered and the chemical composition of the surface is also discussed in comparison with films grown in a standard system. Results to date demonstrate that the enhanced system improves the flexibility of control of the growth parameters in a magnetron sputtering system.
机译:磁控溅射是沉积各种工业上重要的涂层的首选工艺。但是,当前的过程具有固有的局限性。特别地,使用本技术不能容易地改变传递到生长膜的能量,质量通量和入射在基板上的离子与原子的比例,它们对涂层性能具有深远的影响。因此,膜性能可能不是最佳的。为了克服这些限制,正在研究一种增强的溅射系统,其中将替代的等离子体源结合到了其他标准的磁控溅射系统中。新系统结合了无栅线性离子源(LIS)和常规磁控管,形成了可变能量电荷通量磁控管溅射系统(称为M-LIS)。对该系统进行了详细的表征研究,并在此处报告。其中包括系统中的磁场模型,M-LIS在不同操作模式下的性能数据以及该源对金属和陶瓷涂层的结构和性能的影响。与在标准系统中生长的薄膜相比,还讨论了传递的能量与表面化学成分之间的关​​系。迄今为止的结果表明,增强的系统提高了磁控溅射系统中生长参数控制的灵活性。

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