Modeling of the cupping of two-layer laminated densified wood products subjected to moisture and temperature fluctuations: model development

摘要

An asymmetrical two-layer laminated densified wood product is prone to cupping when it is placed in a fluctuating moisture environment. This study was aimed at developing a 2D finite element (FE) model to simulate this situation. Two types of specimens with two thickness ratios of 0.18 (type I) and 0.58 (type II) were prepared. A 6-week moisture and temperature treatment was conducted. The cupping value of deformed specimens was measured for verification. The major results were: (1) The cupping value of type I specimens experimentally measured and predicted was 0.307 and 0.327 mm, respectively, while that of type II specimens was 0.440 and 0.396 mm, respectively; (2) FE and experimental results were in good agreement since the FE results lied in the 95 % confidence interval of the experimental results. The developed FE model can be used to predict the moisture-induced cupping of a two-layer laminated wood product.