Qualcomm's VIVE QCA9500 High Density WiGig/WiFi 802.11 ad Chipset for the 60 GHz Band Teardown Report 2018

摘要

This report includes a full investigation of the module, featuring a detailed study of the SiP and the antenna board including die analyses, processes and board cross-sections. Finally, it contains a complete cost analysis and a selling price estimation of the system.