UDSM Trends Comparison: From Technology Roadmap to UltraSparc Niagara2

摘要

The increased leakage, yield inefficiency, process, power supply, and temperature variations have significant aftereffects on the performance of complex VLSI architectures especially if mapped on ultra deep sub micrometer (UDSM) technologies. In this paper we assess the technology trend based on three industrial technologies (90, 65, and 45 nm) using a state of the art processor as benchmark: The UltraSparc Niagara 2 from SUN Microsystem. We analyze frequency, dynamic, and static power and area after synthesis varying power supply voltage and temperature. We then compare these exhaustive analyses of system level performance as a function of technology to ITRS device level estimations. The results suggest that this prediction can be of help when addressing both the technological scaling and the variability scenario of the selected technology. We believe that correctly predicting specific values on performance variations when realistic conditions and technologies are changed could provide a valuable information for the architect. Our analysis advises the designer on the effective applicability of the ITRS trends to system performance, but also pinpoints that a reliable system level prediction should better take into account the design complexity.