Experimental study on the immersion cooling of an upward-facing multichip module with an opposing condensing surface

摘要

Experiments were conducted to study the heat transfer performance of a simulated immersion cooling module. The test section consisted of three upward-facing, P-doped silicon chips bonded on a substrate and a downward-facing, finned condenser. FC-72 was filled in a space formed between the substrate and the condenser. The effects of space height, cooling water temperature and fin spacing were examined. The wall superheat in the nucleate boiling region was considerably higher than those reported for a metal surface and silicon surfaces with a thin film resistor pattern.