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Solidification Conditions, Heat Treatment and Tensile Ductility of Al-7Si-0.4Mg Casting Alloys

机译:Al-7Si-0.4Mg铸造合金的凝固条件,热处理和拉伸韧性

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An extraction technique has been used to study the size of eutectic silicon particles and flakes, after solution heat treatment, in samples solidified at different rates. It was found that, in samples solidified at 1℃/s or faster, the Si particles attain approximately the same size with solution treatment. For samples solidified at slower rates, the size of the Si particles and flakes increases rapidly with decreasing freezing rate. It is shown that the increase in the size of the Si flakes correlates with a decrease in tensile ductility observed for coarse microstructures. These results are used to discuss the relationship between the cooling rate during solidification, the dendrite cell size and interparticle spacing in the as-cast structure, and the Si particle size and tensile ductility after heat treatment. The analysis indicates that the relative susceptibility of the microstructure to the solution heat treatment and, hence, the relative improvement in tensile ductility with solution treatment depends on the eutectic interparticle spacing. Freezing rates faster than about 1℃/s result in eutectic spacings between 1 and 4 μm. These relatively fine eutectic structures break down and ripen to a uniform particle size of about 4-5 μm during solution heat treatment, resulting in a material with moderate-to-high ductility. Freezing rates of less than about 0.5℃/s result in large eutectic spacings and coarse flakes, which are not refined by solution treatment. Little or no improvement in the ductility can thus be expected, through solution treatment of these coarse microstructures.
机译:固溶热处理后,采用萃取技术研究了以不同速率固化的样品中共晶硅颗粒和薄片的尺寸。结果发现,在以1℃/ s或更快的速度固化的样品中,固溶处理后的Si颗粒尺寸大致相同。对于以较低速度固化的样品,Si颗粒和薄片的尺寸会随着冷冻速率的降低而迅速增加。结果表明,硅片的尺寸增加与粗组织观察到的拉伸延展性降低有关。这些结果用于讨论凝固过程中的冷却速度,铸态结构中的枝晶孔尺寸和颗粒间间距以及热处理后的Si颗粒尺寸和拉伸延展性之间的关系。分析表明,微观结构对固溶热处理的相对敏感性以及因此固溶处理的拉伸延性的相对改善取决于共晶颗粒间的间距。冷冻速度快于约1℃/ s,导致共晶间距在1-4μm之间。在固溶热处理期间,这些相对较细的共晶结构分解并成熟为约4-5μm的均匀粒径,从而导致材料具有中等至高的延展性。冷冻速度低于约0.5℃/ s会导致大的共晶间距和粗大的薄片,而固溶处理无法将其精制。通过对这些粗糙的微观结构进行固溶处理,可以预期延展性几乎没有改善。

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