...
机译:用于3维集成电路的纳米颗粒固溶互扩散键的微观结构和机械强度
Department of Mechanical and Aerospace Engineering, Utah State University, Logan, UT 84322, USA;
rnDepartment of Mechanical and Aerospace Engineering, Utah State University, Logan, UT 84322, USA;
rnDepartment of Mechanical and Aerospace Engineering, Utah State University, Logan, UT 84322, USA;
solid liquid inter-diffusion; Sn-Ag-Cu ternary system; intermetallics; bond strength;
机译:瞬时液相键合时间对Cr-Si-B-Ni填充Inconel 625高温合金焊接时的微观结构,等温凝固完成和力学性能的影响
机译:晶片级低温固液间扩散键合,薄AU-SN层,用于MEMS封装
机译:利用固液互扩散机制进行低温晶圆键合
机译:SnAg基固溶体扩散键的结合强度和微观结构
机译:高频三维集成电路的玻璃微凸点结合方法。
机译:液固复合铸造镀锌45钢/ AZ91D双金属材料的组织和力学性能
机译:三维集成电路铜对铜键机械强度的电气表征及建模