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Strength development monitoring and dynamic modulus assessment of cementitious materials using EMI-Miniature Prism based technique

机译:使用基于EMI-Mini Prism的技术对胶凝材料进行强度发展监测和动态模量评估

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Electromechanical impedance (EMI) technique provides an alternative means of characterizing strength development of early age concrete on a real-time basis. However, most existing studies employing the technique heavily rely on statistical tools for strength development characterization. This article proposes a new impedance-based approach to strength and dynamic modulus assessment of cementitious materials. In this approach, a lead zirconate titanate patch is surfaced-bonded on a customized cementitious material specimen, known as 'Miniature Prism', in which the conductance signatures throughout the curing process are acquired. A 3D coupled field finite element (FE) model is then developed to compute the conductance signatures and model updating is performed using the experimental results. The conductance signatures computed by the updated FE model are found to be in good agreement with experimental results. The key contribution of this approach is the use of 'Miniature Prism' which ensures consistency of the resonance peaks in the conductance spectrum between identical specimens. This has been very difficult, if not impossible, to achieve with the conventional EMI technique. This merit allows for modelling of the electromechanical system and hence parametrically predicting the dynamic modulus of elasticity of the cementitious material throughout the curing process. Comparative study is also conducted on various conventional and advanced techniques and results indicate that the proposed technique is effective in strength assessment of cementitious materials. In addition, the technique is suitable for autonomous online monitoring purpose, and thus exhibits promising potential to substitute the conventional non-destructive testing methods.
机译:机电阻抗(EMI)技术提供了另一种实时表征早期混凝土强度发展的方法。但是,大多数采用该技术的现有研究严重依赖于统计工具来进行强度发展表征。本文提出了一种新的基于阻抗的方法来评估胶凝材料的强度和动态模量。用这种方法,将锆钛酸铅贴剂表面粘合在定制的胶结材料试样上,称为“微型棱镜”,在该试样中获得整个固化过程的电导特征。然后开发3D耦合场有限元(FE)模型以计算电导签名,并使用实验结果执行模型更新。发现通过更新的有限元模型计算出的电导签名与实验结果非常吻合。这种方法的关键作用是使用“微型棱镜”,可确保相同样品之间电导谱中共振峰的一致性。使用传统的EMI技术很难甚至不可能做到这一点。该优点允许对机电系统进行建模,从而参数化地预测整个固化过程中胶凝材料的动态弹性模量。还对各种常规技术和先进技术进行了比较研究,结果表明所提出的技术对水泥质材料的强度评估是有效的。另外,该技术适合于自主在线监测目的,因此具有有望替代常规无损检测方法的潜力。

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