首页> 外文期刊>The Structural Design of Tall and Special Buildings >Integrated damping systems for tall buildings: tuned mass damper/double skin facade damping interaction system
【24h】

Integrated damping systems for tall buildings: tuned mass damper/double skin facade damping interaction system

机译:高层建筑的集成阻尼系统:调谐质量阻尼器/双层外墙阻尼相互作用系统

获取原文
获取原文并翻译 | 示例
       

摘要

As today's tall buildings become ever taller and more slender, wind-induced vibration is a serious design issue. This paper presents integrated damping systems for tall buildings. An emphasis is placed on investigating the potential of double skin facades (DSF) as an integrated damping system for tall buildings. In the first scheme, the connectors between the inner and outer skins of the DSF system are designed to have low axial stiffness with a damping mechanism. Through this design, vibration of the primary building structure can be substantially reduced. However, excessive movements of the DSF outer skin masses are a design limitation. In the second scheme, the tuned mass damper (TMD) and DSF damping (DSFD) interaction system is studied to mitigate the design limitation of the first scheme and to resolve other TMD-related design issues. TMDs are usually very large and located near the top of tall buildings for their effective performance. As a result, very valuable occupiable space near the top of tall buildings is sacrificed to contain large TMDs. In addition, installing TMD systems means adding additional masses to tall buildings. Through the TMD/DSFD interaction system, these issues can also be substantially addressed. Compared with the conventional TMD system, the TMD/DSFD interaction system requires a significantly reduced TMD mass ratio to achieve the same target damping ratio. Compared with the first scheme only with the DSFD mechanism, movements of the DSF outer skins can be better controlled in the TMD/DSFD interaction system. Copyright © 2015 John Wiley & Sons, Ltd.
机译:随着当今的高层建筑变得越来越高,越来越苗条,由风引起的振动已成为一个严重的设计问题。本文介绍了用于高层建筑的集成阻尼系统。重点放在研究双层蒙皮外墙(DSF)作为高层建筑的集成阻尼系统的潜力。在第一种方案中,DSF系统的内部和外部蒙皮之间的连接器设计为具有阻尼机制的低轴向刚度。通过这种设计,可以显着降低主建筑结构的振动。但是,DSF外皮肤块的过度运动是设计上的限制。在第二种方案中,研究了调谐质量阻尼器(TMD)和DSF阻尼(DSFD)相互作用系统,以减轻第一种方案的设计局限性并解决其他与TMD相关的设计问题。 TMD通常非常大,并且由于其有效的性能而位于高层建筑的顶部附近。结果,牺牲了高层建筑顶部附近非常宝贵的可占用空间来容纳大型TMD。此外,安装TMD系统意味着要增加高层建筑的质量。通过TMD / DSFD交互系统,这些问题也可以得到实质解决。与传统的TMD系统相比,TMD / DSFD相互作用系统需要显着降低的TMD质量比才能实现相同的目标阻尼比。与仅具有DSFD机制的第一种方案相比,在TMD / DSFD交互系统中可以更好地控制DSF蒙皮的移动。版权所有©2015 John Wiley&Sons,Ltd.

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号