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Temperature Sensor in a Flexible Substrate

机译:柔性基板中的温度传感器

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摘要

This paper presents the fabrication and measured performance of temperature sensors embedded in flexible polyimide substrates. The sensing material used for the temperature sensor was undoped amorphous silicon which was fabricated on a 35-m-thick layer of polyimide that serves as the flexible substrate. Another flexible polyimide superstrate layer of 35-40 m was spin-coated on top of the sensors to make sure the temperature sensors lie on a zero stress plane. The temperature coefficient of resistance was measured over the temperature range of 200- 360 K. The maximum temperature coefficient of resistance at 30 C was measured to be 0.0288 K-1. The effect of the flicker noise and voltage dependence of the voltage noise power spectral density exhibited by the sensor was evaluated. The normalized flicker noise coefficient was found to be 1.2 × 10-11.
机译:本文介绍了嵌入在柔性聚酰亚胺基板中的温度传感器的制造和测量性能。用于温度传感器的传感材料是未掺杂的非晶硅,该非晶硅被制造在35毫米厚的聚酰亚胺层上,该层用作柔性基板。将35-40 m的另一个柔性聚酰亚胺上覆层旋涂在传感器顶部,以确保温度传感器位于零应力平面上。在200-360 K的温度范围内测量电阻的温度系数。在30 C下的最大电阻温度系数经测量为0.0288 K -1 。评估了闪烁噪声的影响以及传感器显示的电压噪声功率谱密度的电压依赖性。归一化的闪烁噪声系数为1.2×10 -11

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  • 来源
    《Sensors Journal, IEEE》 |2012年第5期|p.864-869|共6页
  • 作者

    Ahmed M.;

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