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Macroporous silicon based capacitive affinity sensor―fabrication and electrochemical studies

机译:大孔硅基电容亲和传感器的制作与电化学研究

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摘要

We report the fabrication and characterization of capacitive immunosensors based on electrolyte-insulator-porous silicon (EIS) structures, The sensor structure, gold|silicon|porous silicon|SiO_2|aminosilane|glutaraldehyde|antibody|phosphate-buffered-saline (PBS)[platinum, is fabricated with a low thermal budget process and is found to be five times more sensitive than an immunosensor on polished silicon with identical die area. Macroporous silicon was prepared by electrochemical etching of polished <100> oriented p-type silicon wafers and characterized using SEM, optical microscopy, cyclic voltammetry and impedance spectroscopy. Columnar macroporous structures of different column densities and column sizes were used as the sensor substrates. The capacitive immunosensors were fabricated by anodic oxidation of these porous silicon substrates to form oxide followed by covalent immobilization of antibody (mouse IgG). Antibody-analyte (goat anti-mouse IgG) interactions were monitored via fluorescence microscopy and by change in the measured capacitance. Sensor response was dependent on both the porous silicon column structure and oxide quality.
机译:我们报告了基于电解质-绝缘体-多孔硅(EIS)结构,电容结构,金|硅|多孔硅| SiO_2 |氨基硅烷|戊二醛|抗体|磷酸盐缓冲盐(PBS)的电容式免疫传感器的制造和表征[铂,是用低热预算工艺制造的,发现其灵敏度与裸片面积相同的抛光硅上的免疫传感器相比高五倍。大孔硅是通过对抛光的<100>取向p型硅晶片进行电化学蚀刻而制备的,并使用SEM,光学显微镜,循环伏安法和阻抗谱进行了表征。使用不同柱密度和柱尺寸的柱状大孔结构作为传感器基底。通过对这些多孔硅基板进行阳极氧化以形成氧化物,然后共价固定抗体(小鼠IgG)来制造电容式免疫传感器。通过荧光显微镜和通过测量电容的变化来监测抗体-分析物(山羊抗小鼠IgG)的相互作用。传感器响应取决于多孔硅柱结构和氧化物质量。

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