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Lateral oxidation of AlAs layers at elevated water vapour pressure using a closed-chamber system

机译:使用密闭室系统在升高的水蒸气压力下对AlAs层进行侧向氧化

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We have oxidized AlAs layers laterally in a new type of oxidation system equipped with a closed chamber, in which the vapour pressure of water can be varied over a wide range as a function of the water temperature. Up to a fourfold increase in oxidation speed has been demonstrated with the new system. More strikingly, the saturation effect of the speed of oxidation, known to be caused by a dense As_2O_3-containing region at the oxidation front, appears to be eventually relieved and another oxidation evolution stage begins. This observation, which we believe has been made for the first time, was possible mainly owing to the much extended oxidation time that the closed-chamber system offers. Additionally, there is no active gas flow involved in this new oxidation method and therefore an improved spatial uniformity in oxidation is expected.
机译:我们已经在配备有密闭腔室的新型氧化系统中横向氧化了AlAs层,其中水的蒸汽压可以根据水温在很大范围内变化。新系统已证明氧化速度提高了四倍。更惊人的是,氧化速度的饱和效应似乎最终得以缓解,这是由在氧化前沿的密集的As_2O_3区域引起的,该氧化速度的饱和效应似乎最终得以缓解,并且开始了另一个氧化演化阶段。我们认为这是首次发现,主要是由于闭室系统提供了更长的氧化时间。另外,在这种新的氧化方法中没有活性气体流,因此期望改善的氧化空间均匀性。

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