Evaluation of commercial electroless nickel chemicals for a low cost wafer bumping process

摘要

Several commercial electroless nickel chemicals were evaluated with a low cost wafer bumping process. In this paper we describe some physical and electric properties of the nickel bumps built up by these commercial electroless nickel chemicals. Finally, a commercial chemical was suggested for the low cost wafer bumping process. (Some figures in this article are in colour only in the electronic version)