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Integration of enhancement/depletion- mode InGaP/InGaAs doped-channel pseudomorphic HFETs for direct-coupled FET logic application

机译:集成增强/耗尽模式InGaP / InGaAs掺杂通道伪晶HFET,用于直接耦合FET逻辑应用

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摘要

InGaP/InGaAs-integrated enhancement/depletion-mode doped-channel pseudomorphic HFETs, fabricated on the same chip by a selective etching process, are demonstrated for the first time. For the depletion-mode device, the drain-to-source saturation voltage is only 0.3 V as V_(GS) is fixed at 0 V. An extrinsic transconductance of 411 (278) mS mm~(-1) and a saturation current density of 221 (482) mA mm~(-1) are obtained for the enhancement (depletion) device. Furthermore, the noise margins NM_h and NM_l values are up to 0.731 V (0.72 V) and 0.28 V (0.755 V) at a supply voltage of 1.5 V (2.0 V) in the direct-coupled FET logic application.
机译:首次展示了通过选择性刻蚀工艺在同一芯片上制造的InGaP / InGaAs集成增强/耗尽模式掺杂沟道伪非晶HFET。对于耗尽型器件,当V_(GS)固定为0 V时,漏极至源极的饱和电压仅为0.3V。411(278)mS mm〜(-1)的非本征跨导和饱和电流密度对于增强(耗尽)器件,获得了221(482)mA mm〜(-1)的电流。此外,在直接耦合FET逻辑应用中,在1.5 V(2.0 V)的电源电压下,噪声容限NM_h和NM_1的值分别高达0.731 V(0.72 V)和0.28 V(0.755 V)。

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