Diffusion phenomena in atomic layer deposition

摘要

Atomic layer deposition (ALD) is a mature technology for the deposition of conformal thin films. During the ALD process or in a post-treatment, a variety of diffusion phenomena can occur which can not only deteriorate the desired product, but also can be used to fabricate materials or structures in a novel way. This special issue reviews some of the observed diffusion processes and strategies to make use of those.