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OBIC technique applied to wide bandgap semiconductors from 100K up to 450K

机译:OBIC技术应用于从100K到450K的宽带隙半导体

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摘要

Wide bandgap semiconductors have recently become more frequently used in the power electronics domain. They are predicted to replace traditional silicon, especially for high voltage and/or high frequency devices. Device design has made a lot of progress in the last two decades. Substrates up to six inches in diameter have now been commercialized with very low defect densities. Such a development is due to continuous studies. Of these studies, those that allow an excess of charge carriers in the space charge region (like OBIC - optical beam induced current, and EBIC - electron beam induced current) are useful to analyze the variation of electric field as a function of the voltage and the beam position. This paper shows the OBIC technique applied to wide bandgap semiconductor-based devices. OBIC cartography gives an image of the electric field in the device, and the analysis of the OBIC signal helps one to determine some characteristics of the semiconductors, like minority carrier lifetime and ionization rates. These are key parameters to predict device switching behavior and breakdown voltage.
机译:宽带隙半导体近来在电力电子领域中变得越来越频繁。预计它们将取代传统的硅,特别是对于高压和/或高频设备。在过去的二十年中,设备设计取得了很大的进步。直径高达六英寸的基板现已商业化,缺陷密度非常低。这种发展是由于不断的研究。在这些研究中,那些允许在空间电荷区域中过量载流子的研究(如OBIC-光束感应电流和EBIC-电子束感应电流)对于分析电场随电压和电压的变化是有用的。光束位置。本文展示了适用于宽带隙半导体基器件的OBIC技术。 OBIC制图给出了设备中电场的图像,对OBIC信号的分析有助于确定半导体的某些特性,例如少数载流子寿命和电离率。这些是预测器件开关性能和击穿电压的关键参数。

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