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Topical review hierarchy of simulation approaches for hot carrier transport in deep submicron devices

机译:深亚微米设备中热载流子传输的模拟方法的主题审查层次结构

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摘要

Rapid advances in integrated circuit technology are pushing the size of semiconductor devices into the deep submicron range. The traditional simulation approaches based on simplified transport equations are not adequate to capture the behaviour of high-energy carriers that are responsible for nonlinear transport behaviour and reliability problems. This brief review examines the complete hierarchy of device simulation approaches and analyses the capabilities and limitations of the various approaches that are available today.
机译:集成电路技术的飞速发展将半导体器件的尺寸推向了深亚微米范围。传统的基于简化输运方程的仿真方法不足以捕获负责非线性输运行为和可靠性问题的高能载流子的行为。本文简要回顾了设备仿真方法的完整层次,并分析了当今各种方法的功能和局限性。

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