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Mapping of n-GaN Schottky contacts formed on facet-growth substrates using near-ultraviolet scanning internal photoemission microscopy

机译:近紫外线扫描内部光曝光显微镜映射在小型生长衬底上形成的N-GaN肖特基触点的映射

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摘要

Scanning internal photoemission microscopy (SIPM) is applied to characterize Ni Schottky contacts formed on a thick low-carrier-density drift layer grown on facet-growth freestanding GaN substrate. Four variations of the Schottky contact dots are prepared, those formed in the c-plane growth region, in the facet growth region, in the region including the boundary between the c-plane and facet regions, and in a region including a large-dislocation-density area at the center of the facet growth region. For all the samples, the SIPM photoyield (Y) maps obtained using visible lasers showed that the Y and Schottky barrier height were sufficiently uniform over the contacts, resulting in uniform metal-semiconductor interfaces. The growth mode boundary and the large-dislocation area, as a vague pattern consisting of large- and small-Y regions of about 100 mu m, are clearly observed in the Y map using a near-ultraviolet laser. Device breakdown under high voltage occurred in the large-dislocation-density region with large Y. The results indicate that this method can predict device failure in conjunction with crystal defects and the electrical characteristics of Schottky contacts.
机译:扫描内部光曝光显微镜(SIPM)用于表征形成在小平面上生长的GaN衬底上生长的厚低载体密度漂移层上的Ni肖特基触点。制备肖特基触点点的四个变型,在包括在内的区域生长区域中形成在C面生长区域中的那些,包括C平面和面部区域之间的边界,以及包括大错位的区域 - 刻面增长区中心的密度区域。对于所有样品,使用可见光仪获得的SIPM Photoyield(Y)地图显示Y和肖特基势垒高度在触点上足够均匀,导致均匀的金属半导体接口。使用近紫外激光,在Y地图中清楚地观察到增长模式边界和大脱位区域,作为由大约100μm的大和小y区域组成的模糊模式。在具有大Y的大脱位密度区域中发生高电压下的设备故障。结果表明该方法可以与晶缺陷和肖特基触点的电气特性相结合预测器件故障。

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