A Replacement for RCA Cleans

摘要

Finding a chemical mixture that is easier and whose properties allow extensive use for single and/or batch wafer cleaning — instead of the dominant RCA clean — is an industry-wide challenge. A researcher in France found that an OAM (ozonated acid mixture) could be the solution for a versatile cleaning dedicated to single-wafer treatment. However, the OAM cleaning step does not correspond with the traditional DHF:O_3 bath by the method of chemical blending and gas reaction. It continuously uses a fresh mixture, allowing the use of small concentrations of acid chemistries and a high level of ozone.