Laser Spike Annealing

摘要

With the progression to smaller design rules comes the need to en-gineer shallower and more abrupt junctions with higher active dopant concentrations. Additionally, new materials put more stringent requirements on thermal management. This requires annealing tools capable of shorter duration processing and more precise temperature control. The industry has successfully demonstrated laser spike annealing (LSA) as a disruptive technology for advanced junction engineering, which creates near diffusionless junctions with low electrical resistance.