In the cleaning process that is essential for producing semiconductor and precision equipment, the introduction of a cleaning technology that uses supercritical fluid, mainly CO_2, is beginning to gain momentum as an alternative to technologies using specified fluorocarbons such as CFC and others.rnThe 1,1,1-trichloroethane and CFC (chlorofluorocarbon), designated as ozone-depleting substances under the Montreal Protocol, used to be widely used for cleaning processes that are essential for semiconductor production and high-tech industries. However, since the use of these substances was abolished completely, development of an alternative cleaning method has been an urgent task. Transition to water-based cleaning, alcohol cleaning and hydrocarbon cleaning has been made so far. But because each of these methods has its own shortcomings, the development of a new technology with higher cleaning performances has been desired.
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