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Fabrication and characterization of Ti-Ni shape memory thin film using Ti/Ni multilayer technique

机译:Ti / Ni多层技术制备和表征Ti-Ni形状记忆薄膜

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Alloying process and shape memory properties of a Ti/Ni multilayer thin film fabricated by a dual d.c. magnetron sputter-deposition method were investigated, and compared with those of a Ti-Ni amorphous thin film fabricated by an alloy target sputter-deposition method. The multilayer thin film was made by depositing Ti and Ni layers alternately on a SiO_2/Si substrate. The Ti and Ni of the Ti/Ni multilayer thin film were crystalline after deposition. Alloying of the Ti/Ni multilayer thin film proceeded in multi steps. Amorphous phase was formed at the interfaces between the Ti and Ni layers by inter-diffusion of the Ti and Ni atoms during heating up to 640 K. Ni-rich Ti-Ni B2 phase was formed during heating up to 710 K. During further heating up to 750 K, the Ni-content of the Ti-Ni B2 phase decreased and Ti2Ni phase was formed. The Ti/Ni multilayer thin film exhibited shape memory effect after heat-treatment at 673 K where Ti-Ni amorphous thin films were not crystallized. The heat-treated Ti/Ni multilayer thin films exhibited the shape memory effect equivalent to that of the heat-treated Ti-Ni amorphous thin films when the heat-treatment temperature was above 873 K.
机译:双d.c.制备的Ti / Ni多层薄膜的合金化工艺和形状记忆性能。研究了磁控溅射沉积方法,并将其与通过合金靶溅射沉积方法制备的Ti-Ni非晶薄膜进行了比较。多层薄膜是通过在SiO_2 / Si基板上交替沉积Ti和Ni层而制成的。沉积后,Ti / Ni多层薄膜的Ti和Ni结晶。 Ti / Ni多层薄膜的合金化过程分多个步骤进行。通过加热至640 K时Ti和Ni原子的相互扩散,在Ti和Ni层之间的界面上形成了非晶相。在加热至710 K的过程中形成了富Ni的Ti-Ni B2相。直至750 K,Ti-Ni B2相的Ni含量降低,形成Ti2Ni相。 Ti / Ni多层薄膜在673 K热处理后表现出形状记忆效应,其中Ti-Ni非晶薄膜未结晶。当热处理温度高于873 K时,热处理过的Ti / Ni多层薄膜表现出与热处理过的Ti-Ni无定形薄膜相同的形状记忆效应。

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