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Simplifying RF front-end design in multiband handsets

机译:简化多频段手机中的射频前端设计

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摘要

Ruthless competition in the handset market continues to drive manufacturers to search for new opportunities to drive down cost, printed circuit board (PCB) area and power consumption. Simultaneously, the rollout of third-generation (3G) networks has opened the door to a variety of new multimedia and data-based applications, from wireless Internet access and mobile video to text messaging and mobile TV. As demand for these new applications rises and the market becomes increasingly globalized, handset makers face a quandary. How can they support the increasing number of frequency bands to support global platforms and the multiple high-bandwidth technologies needed to deliver these new revenue-enhancing services without violating the market's strict cost, footprint and power constraints? The number of frequencies supported by the latest 3G partnership program (3GPP) standard has increased from three to 10 and is set to continue to expand. The current frequency bands and their associated bandwidths are shown in Figure 1.
机译:手机市场的残酷竞争继续促使制造商寻找新的机会来降低成本,降低印刷电路板(PCB)面积和功耗。同时,第三代(3G)网络的推出为各种新的基于多媒体和数据的应用打开了大门,从无线Internet访问和移动视频到文本消息和移动电视。随着对这些新应用程序的需求增加以及市场日益全球化,手机制造商面临困境。它们如何在不违反市场严格的成本,占地面积和功率限制的情况下,支持越来越多的频带以支持全球平台以及提供这些新的增收服务所需的多种高带宽技术?最新的3G合作伙伴计划(3GPP)标准支持的频率数量已从三个增加到10个,并且将继续扩大。当前频段及其相关带宽如图1所示。

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